Custom Sensor Packaging

Engineered from the Inside Out

At SAAZ, sensor performance doesn’t stop at the focal plane—it’s amplified through precision-engineered packaging. Our Custom Sensor Packaging solutions are designed to meet the extreme environmental, mechanical, and thermal demands of aerospace, defense, space, and industrial missions.

From deep-space radiation shielding to high-vibration tactical platforms, we develop packaging that protects, connects, and optimizes. Whether you’re integrating a high-performance ROIC, an infrared focal plane, or a multispectral array, our team ensures the sensor package is as robust and mission-ready as the sensor itself.

Our Offerings

Explore the capabilities that set SAAZ custom sensor packaging apart:

Mission-Specific Packaging Designs

Tailored solutions for cryogenic space missions, high-G defense platforms, and rugged industrial deployments.

Vacuum & Thermal Management

Hermetic sealing, thermal dissipation, and cooling interfaces engineered for long-term performance and stability.

Electrical & Optical Interfacing

Precision-aligned interconnects, lens mounts, and windows designed to ensure optimal optical paths and electronic connectivity.

Materials Engineering

Custom packaging materials including ceramics, metal alloys, and composites for conductivity, shielding, and mechanical durability.

SWaP-C Optimization

Packages engineered for minimal size, weight, and power without compromising protection or alignment.

Flexible Integration Models

Options for wafer-level, chip-on-board, hybrid, or full module integration—compatible with your system architecture.

Applications

See how SAAZ EBS technology is enabling the next generation of sensing:

Cryogenic Packaging for Deep Space Sensors

Developed multi-layer vacuum-sealed packages with low-outgassing materials and custom thermal interface materials for planetary exploration.

Vibration-Hardened IR Modules

Designed rugged housings with shock-resistant mounts for battlefield surveillance payloads deployed on UAVs and mobile platforms.

Miniaturized Sensor Stacks

Delivered stacked sensor modules with precise alignment and bonding for hand-held multispectral analysis tools.

Frequently Asked
Questions

Our packages are designed for extreme conditions—from cryogenic temperatures in space to high-shock, high-vibration defense applications.
Yes. We engineer vacuum-sealed, thermally stabilized packages to ensure sensor stability in both ambient and space conditions.
Absolutely. Our solutions are optimized for small form factors and low power, ideal for UAVs, nanosats, and portable systems.
We use mission-specific materials such as ceramics, high-grade metals, and custom composites for conductivity, insulation, and structural integrity.
Yes. We provide flexible integration—supporting chip-on-board, stacked modules, and full hybrid packaging based on your system design.

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Ready to Package Your Vision?

SAAZ custom sensor packaging protects what matters—so your mission can go farther, faster, and with absolute precision.

→ Contact our sensor integration team to start designing your custom solution.

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